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How Leaders Build for the Next Era of Compute – with Sam Grove of MIPS

Consolidating hardware into fewer, more capable chips looks like an unambiguous win — until the complexity those separate components used to handle resurfaces in the software binding everything back together. In this episode, Sam Grove, Head of Software and Tools Business at MIPS, examines why hardware and software teams can’t keep building in sequence, and

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AI-era chips will be defined by custom compute, memory proximity, efficiency: Executives

At the ETElectronicsWorld Design & Verification Summit 2026 in Bengaluru, semiconductor leaders said the next wave of AI compute will move towards workload-specific silicon, edge intelligence, advanced packaging and AI-assisted design, while power, memory movement and system-level skills emerge as critical constraints.

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