Chip Industry Week In Review
The Japanese government approved $3.9 billion in funding for chipmaker Rapidus to expand its foundry business, of which 10% will be invested in advanced packaging. This is in addition to the previously announced $2.18 billion in funding. In a meeting next week, the U.S. and Japan are expected to cooperate on increasing semiconductor development and trade in an effort to reduce dependence on China. The announcement comes amid continuing tensions between China and the U.S. over trade sanctions in advanced semiconductor equipment and materials.
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