MIPS Products

Hard IP Cores

Hard IP cores enable a cost-effective, low-risk, and easy way for budget-conscience startups, fabless semiconductor companies, and system OEMs to integrate the high-performance MIPS® architecture into digital consumer devices like set-top boxes, digital cameras, and digital televisions.

Built using the latest design methodologies, standard cell libraries and memories, MIPS Technologies hard IP cores represent state-of-the-art hard IP. The small area of the hard core realizes significant cost savings for users and stands out from cores in the equivalent performance class. Coupled with a robust development environment these hard cores dramatically reduce SoC implementation time.

The following cores are currently available for direct licensing from MIPS Technologies:

M4K® Hard IP Cores
Process0.18µm SMIC – Speed Opt 0.18µm SMIC - Area Opt
Frequency*137 MHz1110 MHz1
Core Size0.65 sq. mm0.40 sq. mm


4Kc® Hard IP Core
Process0.18µm SMIC
Performance190 MHz *
Area3.42 sq.mm including caches
Caches8K/8K (2-way)


4KEc® Hard IP Cores
Process0.13µm G TSMC CL013G0.18µm G TSMC CL018G
Performance233 MHz*175 MHz*
Area2.5 sq. mm including caches3.98 sq. mm including caches
Caches8K/8K (2-way)8K/8K (2-way)


24KEc® Hard IP Core
Process90G TSMC0.13µm TSMC
Performance476 MHz *333 MHz1
Area2.4 sq.mm including caches4.33 sq. mm including caches2
Caches16K/16K (4-way)16K/16K (4-way)




MIPS Hard IP Core Design Kit

Hard IP cores are delivered with a design kit that includes all necessary components for the development of a complete SoC:
  • MIPS Core Documentation
  • MIPS Core Design Data
  • MIPS Core Verification and Simulation Models
  • Support
  • Training***

Approved Merging Partners

CMSC

CMSC specializes in providing professional design services from specifications to silicon. The company's headquarter is located in Hsin-Chu City, Taiwan. For more information, please send mail to sales@cmsc.com.tw or call 886-3-563-4866 ext.134.

SMIC (Semiconductor Manufacturing International Corporation)

SMIC is a pure-play IC foundry that offers 0.35ìm to 90nm IC manufacturing services. Established in 2000, SMIC is headquartered in Shanghai and has three 8-inch fabs including a dedicated copper backend line. More than just a wafer foundry, SMIC provides a full suite of value-added services that include design services, mask making, IC manufacturing, and testing. Packaging and final testing are offered through SMIC's assembly and packaging facility in Chengdu or third-party vendors. With strong internal offerings and collaboration with a global network of design service, IP, Library and EDA providers, SMIC offers its customers wide-ranging and flexible design support. For more information, send an email to Design_Services@smics.com.

Socle Technology Corp.

Socle Technology Corp. provides professional SOC platform solutions and services. The company supports the 4K and 4KE families of cores and offers a MIPS-Based, configurable and pre-verified SOC platform solution from specification to RTL development. For more information, please send an email to service@socle-tech.com.tw or call 886-3-516-3166 ext 662 or visit www.socle-tech.com.tw.


TSMC

TSMC is the world's largest dedicated semiconductor foundry, providing the industry's leading process technology and the foundry industry's largest portfolio of process-proven libraries, IP, design tools and reference flows. The Company's total managed capacity in 2006 exceeded seven million (8-inch equivalent) wafers, including capacity from two advanced 12-inch GigaFabs, four eight-inch fabs, one six-inch fab, as well as TSMC's wholly owned subsidiaries, WaferTech and TSMC (Shanghai), and its joint venture fab, SSMC. TSMC is the first foundry to provide 65nm production capabilities. Its corporate headquarters are in Hsinchu, Taiwan. For more information about TSMC please visit http://www.tsmc.com.

*Frequency measured under worst case conditions
(SS process corner, Vdd nom - 10%, Tj=125 oC) and with perfect input clock
*** Additional Support and Training can be purchased separately

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